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Chip Quik

Chip Quik NC191LTA10 Low Temp Solder Paste 10g

  • Sn42/Bi57/Ag1 lead-free alloy, 137 C (279 F) melting point
  • 10 g (3 cc) syringe
  • T4 powder, 20 to 38 microns
  • 86.75% metal by weight
  • Lead-free, RoHS 3 and REACH compliant
  • Stencil life over 8 hours at 20 to 50% RH
  • 0.353 ounces

Last refreshed Sep 11, 2026 · Based on the Amazon listing and published specifications, not hands-on testing.

Our verdict

A lead-free low temperature solder paste in a small syringe, with a synthetic no-clean flux. It needs cold storage, and the low melting alloy should be checked against the application.

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ASIN: B096BMCXHXModel: NC191LTACategory: Solder

Overview

A small repair bench with a lead-free requirement is the place for this Chip Quik low temperature paste. The syringe holds a bismuth-bearing tin alloy in a synthetic no-clean flux vehicle.

The reason to buy it is a very small lead-free syringe for occasional low temperature joints, with a no-clean flux. The limitation is the cold storage and warm-up routine, which is a lot of handling for a small quantity.

Who it's for

Repair benches and hobbyists with an occasional lead-free joint to make will find the small syringe a manageable quantity. Production lines, and anyone needing a leaded or high melting alloy, should choose a larger or different product.

Pros and cons

Pros
  • Small syringe quantity
  • Low melting temperature
  • No-clean synthetic flux
  • RoHS and REACH compliant
Cons
  • Needs refrigeration and warm-up
  • Limited quantity for repeat work

Performance notes

The paste liquefies at a low temperature, so the board and parts take less heat during the joint. It must warm to operating temperature after refrigeration, and stencil life is longer at lower humidity. Stencils can be cleaned automatically or by hand with isopropyl alcohol.

Specifications

BrandChip Quik
ModelNC191LTA
Dimensions & fit
Particle sizeT4 (20 to 38 microns)
Size3 cc / 10 g syringe
Item weight0.353 ounces
Construction & materials
Shelf lifeOver 12 months refrigerated, over 6 months unrefrigerated
Other details
Alloy ratioSn42/Bi57/Ag1 (lead-free)
Melting point137 C (279 F)
Flux typeSynthetic no-clean
Metal content86.75% by weight
Flux classificationROL0
ComplianceLead-free, RoHS 3, REACH, halogen free (EN14582)
Stencil lifeOver 8 hours at 20 to 50% RH, over 4 hours at 50 to 70% RH (22 to 28 C)
StorageRefrigerate at 3 to 8 C (37 to 46 F), do not freeze

Frequently asked questions

Is Chip Quik NC191LTA10 a leaded paste or solder wire?

Neither. It is a lead-free Sn42/Bi57/Ag1 solder paste in a 10 g syringe.

How is Chip Quik NC191LTA10 cleaned from a stencil?

Use automated stencil cleaning systems for both the stencil and misprinted boards, or clean by hand with isopropyl alcohol (IPA).

Does Chip Quik NC191LTA10 ship with restrictions?

No. The listing says it has no shipping restrictions, and normal transit between 0 C and 25 C does not affect its stated shelf life.